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Yacobi (U. of Toronto) and Hubert (Exfor Photonic Solutions, Canada) have expanded a review published in the Journal of Applied Physics on a subject crucial to a wide variety of applications in microelectronics and photonics assemblies and packaging and to the manufacturing of optoelectronic and fiber-optic components, and of medical devices. Photocuring of adhesives offers advantages related to its capabilities for instant cure, cure-on-demand, increased production speed, and ease of automation; but its use requires understanding of adhesion, optical, thermal, mechanical, and chemical properties. After an introductory chapter, material is arranged in sections on photonics components, assemblies, and devices; fundamentals of bonding; types of adhesives; photopolymerization techniques; applications in photonics; issues related to optical adhesive bonding; and future directions. Annotation (c) Book News, Inc., Portland, OR (booknews.com)

Procurando Adhesive Bonding in Photonics Assembly and Packaging? Aqui você encontra tudo sobre este livro de B. G. Yacobi, publicado por Amer Scientific Pub. Nesta página estão a descrição da obra, os detalhes da edição (250 páginas) e os formatos disponíveis para baixar: pdf, ibook, epub, kindle. Se você gosta de Livros Internacionais, Engenharia e Transporte, Engenharia, Elétrica e Eletrônica, Ótica, Optoeletrônica, explore também outros títulos da mesma categoria no Porto do livro Português. Veja ainda as outras obras de B. G. Yacobi em nosso catálogo.